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Silicon Recycling
Learn more about how our services can be a low cost, effective, solution for your company.
Silicon Processing & Recovering
Of whole wafers, broken wafers, blue scrap, and precious metals extraction.
Wet • Dry • Pressure
Oscillation process for full IP-Obliteration
Patented Technology
Exclusively available at Silicon 2 Solar.
Strategy
Posed to take advantage of market suppliers to provide low cost solutions
Wet • Dry • Pressure
Oscillation process that aids in a chemical free IP-Obliateration to remove the die off of broken and whole wafers.
Fully Processed Probe Die
Patented technology and processes have allowed us to save customers millions dollars. Silicon 2 Solar is the sole provider of this service. Silicon 2 Solar employs various patent pending processes to truly make green of all your solar panel disposal needs. With the end of life issue plaguing the solar industry, Silicon 2 Solar has positioned itself as the premier provider of truly breaking down these panels to the elemental level and insuring nothing dangerous finds its way into our landfills or precious water supply.
All The Right Things
Years of research and development from pros in the silicon recycling industry have gone into procuring our best practice procedures for dealing with end of life and manufacture reject panels. Separating the aluminum, silicon, glass, and silver, while extracting other trace elements is a tedious process. Upon mastering our physical and chemical processes, we are extremely confident we can help the solar industry solve a plaguing problem to an otherwise amazing alternative energy industry.
Please inquire with any of our Account Executives to see how Silicon 2 Solar processes can help your Green entity dispose of materials in a eco friendly fashion.
Patented, environmentally friendly, acid free wafer stripping process using sophisticated technology and quality IC tools. Continually improving processes to improve yield of fully reclaimed wafers to augment diversification.
Wafer Before IP-Obliteration
Whole and broken wafers before being processed using wet • dry • pressure process.
After IP-Obliteration
Wafer completely obliterated.
12" WHOLE WAFER
IC Grade
Notch
P-type
High Resistivity → .50 OHM CM
FILM Surface
- 725 micron + thickness
- 750 + thickness
- 765 + thickness
12" WHOLE WAFER
C Grade
Notch
P-Type
High Resistivity → .50 OHM CM
BARE Surface DSP
- 700 micron + thickness
- 725 micron + thickness
- 750 + thickness
- 765 + thickness
8" WHOLE WAFER
IC grade
Notch
P-Type
High and Low Res
Varying Thickness Ranges
(Film/Pattern/Bare)
6" WHOLE WAFER
IC Grade
Varying Thicknesses
Varying Surface Finishes
Varying Resistivity Ranges
BROKEN SILICON
IC Grade
High Resistivity: 99% → .50 OHM
(Bare/Film/Pattern)
Surface Condition Mixed
BROKEN SILICON
IC Grade
High Resistivity: → .50 OHM CM
P-Type
Bare Surface Condition
DIE-ON-TAPE
NAND
Processor
DSP
Analog
Sensor
Microcontroller
SPEC TEK
NAND/DRAM Multi-chip Packages (cell phones, mobile applications, and more)
NAND Blue Tape Die
NAND/DRAM Partially and Fully Functional Chips and Package
Known Good Die on Wafer
Technical Support and Data Mapping Documentation
High Volume Allocation Privileges
SOLAR
Various Forms Panels
Mono (Poly Crystalline)
Multi Crystalline
Various Wattage and Voltage Configurations
Solar Installation Design
Permitting
Installation Services
Buy ALL FORMS of silicon wafers of any diameter, broken IC silicon, and broken solar wafers. Download our PDF to see a list of available products.
Contact us for more information about the different products we have listed here. We the many variations that we carry, can provide more detailed information on specific combinations.
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