Silicon Processing & Recovering

Of whole wafers, broken wafers, blue scrap, and precious metals extraction.

Wet • Dry • Pressure

Oscillation process for full IP-Obliteration

Patented Technology

Exclusively available at Silicon 2 Solar.

Strategy

Posed to take advantage of market suppliers to provide low cost solutions

Wet • Dry • Pressure

Wet • Dry • Pressure

Oscillation process that aids in a chemical free IP-Obliateration to remove the die off of broken and whole wafers.

Fully Processed Probe Die

Fully Processed Probe Die

Patented technology and processes have allowed us to save customers millions dollars. Silicon 2 Solar is the sole provider of this service. Silicon 2 Solar employs various patent pending processes to truly make green of all your solar panel disposal needs. With the end of life issue plaguing the solar industry, Silicon 2 Solar has positioned itself as the premier provider of truly breaking down these panels to the elemental level and insuring nothing dangerous finds its way into our landfills or precious water supply.

All The Right Things

Years of research and development from pros in the silicon recycling industry have gone into procuring our best practice procedures for dealing with end of life and manufacture reject panels. Separating the aluminum, silicon, glass, and silver, while extracting other trace elements is a tedious process. Upon mastering our physical and chemical processes, we are extremely confident we can help the solar industry solve a plaguing problem to an otherwise amazing alternative energy industry.

Please inquire with any of our Account Executives to see how Silicon 2 Solar processes can help your Green entity dispose of materials in a eco friendly fashion.

Patented, environmentally friendly, acid free wafer stripping process using sophisticated technology and quality IC tools. Continually improving processes to improve yield of fully reclaimed wafers to augment diversification.

Wafer Before IP-Obliteration

Wafer Before IP-Obliteration

Whole and broken wafers before being processed using wet • dry • pressure process.

After IP-Obliteration

After IP-Obliteration

Wafer completely obliterated.

12″ WHOLE WAFER

12″ WHOLE WAFER

IC Grade
Notch
P-type
High Resistivity → .50 OHM CM
FILM Surface

  • 725 micron + thickness
  • 750 + thickness
  • 765 + thickness

12″ WHOLE WAFER

12″ WHOLE WAFER

C Grade
Notch
P-Type
High Resistivity → .50 OHM CM
BARE Surface DSP

  • 700 micron + thickness
  • 725 micron + thickness
  • 750 + thickness
  • 765 + thickness

8″ WHOLE WAFER

8″ WHOLE WAFER

IC grade
Notch
P-Type
High and Low Res
Varying Thickness Ranges
(Film/Pattern/Bare)

6″ WHOLE WAFER

6″ WHOLE WAFER

IC Grade
Varying Thicknesses
Varying Surface Finishes
Varying Resistivity Ranges

BROKEN SILICON

BROKEN SILICON

IC Grade
High Resistivity: 99% → .50 OHM
(Bare/Film/Pattern)
Surface Condition Mixed

BROKEN SILICON

BROKEN SILICON

IC Grade
High Resistivity: → .50 OHM CM
P-Type
Bare Surface Condition

DIE-ON-TAPE

DIE-ON-TAPE

NAND
Processor
DSP
Analog
Sensor
Microcontroller

SPEC TEK

NAND/DRAM Multi-chip Packages (cell phones, mobile applications, and more)
NAND Blue Tape Die
NAND/DRAM Partially and Fully Functional Chips and Package
Known Good Die on Wafer
Technical Support and Data Mapping Documentation
High Volume Allocation Privileges

SOLAR

Various Forms Panels
Mono (Poly Crystalline)
Multi Crystalline
Various Wattage and Voltage Configurations
Solar Installation Design
Permitting
Installation Services

Buy ALL FORMS of silicon wafers of any diameter, broken IC silicon, and broken solar wafers. Download our PDF to see a list of available products.

Contact us for more information about the different products we have listed here. We the many variations that we carry, can provide more detailed information on specific combinations.